MAX17108ETI+
II. Manufacturing Information
A. Description/Function:
10-Channel High-Voltage Scan Driver and VCOM Amplifier for TFT LCD
Panels
B. Process:
S45URS
C. Number of Device Transistors:
2918
D. Fabrication Location:
E. Assembly Location:
Texas
UTL Thailand
October 21, 2008
F. Date of Initial Production:
III. Packaging Information
A. Package Type:
B. Lead Frame:
28-pin TQFN 5x5
Copper
C. Lead Finish:
100% matte Tin
Conductive Epoxy
Au (1.0 mil dia.)
Epoxy with silica filler
#
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
Class UL94-V0
Level 1
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
47°C/W
2.1°C/W
29°C/W
2.1°C/W
IV. Die Information
A. Dimensions:
60 X 128 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/0.5% Cu
None
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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