Hig h -S p e e d , Lo w -P o w e r, S in g le -S u p p ly,
Mu lt ic h a n n e l, Vid e o Mu lt ip le x e r-Am p lifie rs
0–MAX4315
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
20
0
-20
-40
-60
-80
-100
-120
-140
-160
0
50 100 150 200 250 300 350 400 450 500
LOGIC-LOW THRESHOLD (mV ABOVE V )
0
50 100 150 200 250 300 350 400 450 500
LOGIC-LOW THRESHOLD (mV ABOVE V )
EE
EE
Figure 4. Logic-Low Input Current vs. V with 10kΩ Series
Resistor
IL
Figure 2. Logic-Low Input Current vs. V (SHDN, A0, A1, A2)
IL
For normal operation, drive SHDN high. If the shutdown
LOGIC INPUT
function is not used, connect SHDN to V
.
CC
La yo u t a n d P o w e r-S u p p ly Byp a s s in g
The MAX4310–MAX4315 have very high bandwidths
and consequently require careful board layout, includ-
ing the possible use of constant-impedance microstrip
or stripline techniques.
10k
IN-
SHDN, A0, A1, A2
OUT
MAX431_
To realize the full AC performance of these high-speed
a mp lifie rs , p a y c a re ful a tte ntion to p owe r-s up p ly
bypassing and board layout. The PC board should
have at least two layers: a signal and power layer on
one side, and a large, low-impedance ground plane on
the other side. The ground plane should be as free of
voids as possible, with one exception: the feedback
(FB) should have as low a capacitance to ground as
possible. Therefore, layers that do not incorporate a
signal or power trace should not have a ground plane.
IN+
Figure 3. Circuit to Reduce Logic-Low Input Current
Lo w -P o w e r S h u t d o w n Mo d e
All parts feature a low-power shutdown mode that is
activated by driving the SHDN input low. Placing the
amplifier in shutdown mode reduces the quiescent sup-
ply current to 560µA and places the output into a high-
impedance state, typically 35kΩ. By tying the outputs
of several devices together and disabling all but one of
the paralleled amplifiers’ outputs, multiple devices may
be paralleled to construct larger switch matrices.
Whether or not a constant-impedance board is used, it
is b e s t to ob s e rve the following g uid e line s whe n
designing the board:
1) Do not us e wire -wra p p e d b oa rd s (the y a re too
inductive) or breadboards (they are too capacitive).
For MAX4310/MAX4311/MAX4312 application circuits
operating with a closed-loop gain of +2V/V or greater,
consider the external-feedback network impedance of
all devices used in the mux application when calculat-
ing the total load on the output amplifier of the active
device. The MAX4313/MAX4314/MAX4315 have a fixed
gain of +2V/V that is internally set with two 500Ω thin-
film resistors. The impedance of the internal feedback
resistors must be taken into account when operating
multiple MAX4313/MAX4314/MAX4315s in large multi-
plexer applications.
2) Do not us e IC s oc ke ts ; the y inc re a s e p a ra s itic
capacitance and inductance.
3) Keep signal lines as short and straight as possible.
Do not make 90° turns; round all corners.
4) Observe high-frequency bypassing techniques to
maintain the amplifier’s accuracy and stability.
5) Use surface-mount components. They generally
have shorter bodies and lower parasitic reactance,
yielding better high-frequency performance than
through-hole components.
______________________________________________________________________________________ 13
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
