5V/3.3V or Adjustable, Low-Dropout,
Low I
Q
, 200mA Linear Regulators
MAX882/MAX883/MAX884
MAX883, V
OUT
= 5V
8-PIN SO PACKAGE
77.4cm
2
,
SINGLE-SIDED BOARD
1oz COPPER
GLASS EPOXY,
T
J
= +125°C,
T
A
= +25°C, STILL AIR
MAX882/4-fig04
1.6
1.5
POWER DISSIPATION (W)
1.4
1.3
1.2
1.1
1.0
MAXIMUM OUTPUT CURRENT (mA)
MAXIMUM CURRENT
TYPICAL DROPOUT VOLTAGE LIMIT
MAXIMUM POWER
DISSIPATION LIMIT
MAXIMUM SUPPLY VOLTAGE LIMIT
MAXIMUM SUPPLY VOLTAGE LIMIT
200
150
HIGH-
POWER
SOIC
PLASTIC DIP
CERAMIC DIP
100
50
0.9
0.1cm
2
0.0155in
2
1cm
2
0.155in
2
10cm
2
1.55in
2
100cm
2
15.5in
2
0
2
3
4
OPERATING
REGION AT
T
A
= +25°C
T
J
= +125°C
5 6
7
8
9 10 11 12 13
COPPER GROUND PAD AREA
SUPPLY VOLTAGE (V)
Figure 4. Typical Maximum Power Dissipation vs. Ground Pad
Area
Figure 5a. Safe Operating Regions: MAX882/MAX884 Maximum
Output Current vs. Supply Voltage
The GND pins of the MAX882/MAX883/MAX884 SOIC
package perform the dual function of providing an elect-
rical connection to ground and channeling heat away. Con-
nect all GND pins to ground using a large pad or ground
plane. Where this is impossible, place a copper plane on an
adjacent layer. For a given power dissipation, the pad
should exceed the associated dimensions in Figure 4.
Figure 4 assumes the IC is in an 8-pin small-outline pack-
age that has a maximum junction temperature of +125°C
and is soldered directly to the pad; it also has a +25°C
ambient air temperature and no other heat sources. Use
larger pad sizes for other packages, lower junction tem-
peratures, higher ambient temperatures, or conditions
where the IC is not soldered directly to the heat-sinking
ground pad. When operating C- and E-grade parts up to a
T
J
of +125°C, expect performance similar to M-grade
specifications. For T
J
between +125°C and +150°C, the
output voltage may drift more.
The MAX882/MAX883/MAX884 can regulate currents up
to 250mA and operate with input voltages up to 11.5V, but
not simultaneously. High output currents can only be sus-
tained when input-output differential voltages are small, as
shown in Figure 5. Maximum power dissipation depends
on packaging, temperature, and air flow. The maximum
output current is as follows:
I
OUT(MAX)
=
P(T
J
−
T
A
)
(V
IN
−
V
OUT
)100
°
C
MAXIMUM OUTPUT CURRENT (mA)
MAXIMUM CURRENT
200
TYPICAL DROPOUT VOLTAGE LIMIT
MAXIMUM POWER
DISSIPATION LIMIT
HIGH-
POWER
SOIC
150
PLASTIC DIP
100
CERAMIC DIP
50
OPERATING
REGION AT
T
A
= +25°C
T
J
= +125°C
5
6
7
8
9
10
11 12
0
4
13
SUPPLY VOLTAGE (V)
Figure 5b. Safe Operating Regions: MAX883 Maximum Output
Current vs. Supply Voltage
where P is derived from Figure 4.
10
______________________________________________________________________________________
MAX882/4-05b
250
MAX882/4-05a
250
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
