MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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$% !"#
3SMAJ5913B
THRU
3SMAJ5943B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
Features
Surface Mount Application
3.3
thru
56
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC
(SMA) (LEAD FRAME)
H
J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
NOTES:
1.
2.
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
E
1.5V
3.0W
-55
o
C to
+150
o
C
(Note: 1)
(Note: 2)
D
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
B
R
thJL
25
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
Forward Current @ 200mA.
Mounted on 5.0mm (.013mm thick) Iand areas.
Lead temperature at T
L
=75 C
0.05
MI N
2
0.058 ” MI N
o
Revision:
3
www.mccsemi.com
1 of 4
2007/04/19