MCC
Features
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omponents
21201 Itasca Street Chatsworth
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BZX84C2V4W
THRU
BZX84C39W
Silicon
200 mWatt
Zener Diodes
Planar Die construction
200mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
.
Mechanical Data
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Case: SOT-23, Plastic
A
SOT-323
Terminals: solderable per MIL-STD-202, Methode 208
Weight: 0.008 grams (approx.)
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
200
mWatt
(Note 1)
Operation And
T
J
, T
STG
-55
o
C to
Storage
+150
o
C
Temperature
Peak Foreard Surge
I
FSM
2.0
A
Current 8.3mS half
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
D
E
G
H
F
DIMENSIONS
INCHES
MIN
.070
.078
.045
.047
---
.0078
.035
.002
.010
MM
MIN
1.80
2.00
1.15
1.20
---
.20
.90
.05
.25
I
DIM
A
B
C
D
E
F
G
H
I
MAX
.087
.087
.054
.056
.004
.0160
.044
.006
---
MAX
2.20
2.20
1.35
1.40
.10
.40
1.10
.15
---
NOTE
Suggested Solder
Pad Layout
.031
.800
.047
1.20
.118
3.00
.024
.600
.075
1.90
inches
mm
.026
.650
.026
.650
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