MCC
Features
ER3AB
omponents
21201 Itasca Street Chatsworth
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THRU
ER3JB
•
•
•
•
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For Surface Mount Applications
Extremely Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 250°C for 10 Seconds At Terminals\
Super Fast Recovery Times For High Effieciency
3 Amp Super Fast
Recovery
Silicon Rectifier
50 to 600 Volts
DO-214AA
(SMBJ) (LEAD FRAME)
A
Maximum Ratings
•
•
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Operating Temperature: -50°C to +150°C
Storage Temperature: -50°C to +150°C
Maximum Thermal Resistance; 16
°C/W
Junction To Lead
MCC
Catalog
Number
ER3AB
ER3BB
ER3CB
ER3DB
ER3GB
ER3JB
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
150V
200V
400V
600V
Maximum
RMS
Voltage
35V
70V
105V
140V
280V
420V
Maximum
DC
Blocking
Voltage
50V
100V
150V
200V
400V
600V
B
ER3AB
ER3BB
ER3CB
ER3DB
ER3GB
ER3JB
C
F
H
D
G
E
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
ER3AB-3DB
ER3GB
ER3JB
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Maximum Reverse
Recovery Time
Typical Junction
Capacitance
I
F(AV)
I
FSM
3.0A
100A
T
L
=
75°C
8.3ms, half sine
DIM
A
B
C
D
E
F
G
H
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.01
1.91
0.05
MAX
.185
.155
.012
.060
.220
.103
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.62
2.21
0.203
NOTE
V
F
.95V
1.25V
1.70V
5µA
200µA
35ns
45pF
I
FM
= 3.0A;
T
J
= 25°C
SUGGESTED SOLDER
PAD LAYOUT
0.106
I
R
T
J
= 25°C
T
J
= 100°C
I
F
=0.5A, I
R
=1.0A,
I
rr
=0.25A
Measured at
1.0MHz, V
R
=4.0V
0.083”
T
rr
C
J
0.050”
*Pulse test: Pulse width 300
µsec,
Duty cycle 2%
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MCC [ Micro Commercial Components ]
