MCC
Features
•
•
•
•
omponents
21201 Itasca Street Chatsworth
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GS1A
THRU
GS1M
For Surface Mount Applications
Extremely Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 250°C for 10 Seconds At Terminals
1 Amp
Silicon Rectifier
50 to 1000 Volts
DO-214AC
(SMAJ) (High Profile)
H
Cathode Band
•
•
•
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 15
°C/W
Junction To Lead
MCC
Catalog
Number
GS1A
GS1B
GS1D
GS1G
GS1J
GS1K
GS1M
Device
Marking
GS1A
GS1B
GS1D
GS1G
GS1J
GS1K
GS1M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
DIM
A
B
C
D
E
F
G
H
J
J
A
C
E
F
G
D
B
DIMENSIONS
INCHES
MIN
.078
.067
.002
---
.035
.065
.205
.160
.100
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
I
F(AV)
I
FSM
1.0A
30A
T
J
= 75°C
8.3ms, half sine,
I
FM
= 1.0A;
T
J
= 25°C*
MAX
.116
.089
.008
.02
.055
.096
.224
.180
.112
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
V
F
1.1V
SUGGESTED SOLDER
PAD LAYOUT
0.090”
I
R
C
J
10µA
50µA
15pF
T
J
= 25°C
T
J
= 125°C
Measured at
1.0MHz, V
R
=4.0V
0.085”
*Pulse test: Pulse width 300
µsec,
Duty cycle 2%
0.070”
www.mccsemi.com
MCC [ Micro Commercial Components ]
