MCC
Features
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Low Reverse Recovery Time
Low Reverse Capacitance
Low Forward Voltage Drop
omponents
21201 Itasca Street Chatsworth
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LLSD101A
THRU
LLSD101C
Schottky Barrier
Switching Diode
Guard Ring Construction for Transient Protection
Mechanical Data
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Case: MiniMELF, Glass
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Terminals: Solderable per MIL -STD -202, Method 208
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Polarity: Indicated by Cathode Band
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Weight: 0.05 grams ( approx.)
Cathode Mark
MINIMELF
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current(Note 1)
Non-Repetitive Peak @ t<=1.0s
Forward Surge Current @ t=10us
Power Dissipation(Note 1)
Thermal Resistance(Note 1)
Operation & Storage Temp. Range
Symbol LLSD101A LLSD101B LLSD101C
V
RRM
V
RWM
60V
50V
40V
V
R
V
R(RMS)
I
FM
I
FSM
Pd
R
Tj, T
STG
42V
35V
15mA
50mA
2.0A
DIMENSION
400mW
375K/W
-55 to 150 C
o
C
B
A
28V
DIM
A
B
C
INCHES
MIN
.134
.008
.055
MAX
.142
.016
.059
MIN
3.40
.20
1.40
MM
MAX
3.60
.40
1.50
NOTE
Electrical Characteristics @ 25
o
C Unless Otherwise Specified
Charateristic
Symbol
Peak
LLSD101A
Reverse LLSD101B
I
R M
Current
LLSD101C
LLSD101A
LLSD101B
Forward
LLSD101C
V
FM
Volt. Drop LLSD101A
LLSD101B
LLSD101C
Junction
LLSD101A
Capacitance LLSD101B
Cj
LLSD101C
Reverse Recovery Time
t
rr
Min
Max
200
0.41
0.40
0.39
1.00
0.95
0.90
2.0
2.1
2.2
1.0
Unit
nA
Test Cond.
V
R
=50V
V
R
=40V
V
R
=30V
I
F
=1.0mA
I
F
=1.0mA
I
F
=1.0mA
I
F
= 1 5 m A
I
F
= 1 5 m A
I
F
= 1 5 m A
V
R
=0V, f=1.0MHz
I
F
= I
R
=5mA,
recover to 0.1 I
-----
SUGGESTED SOLDER
PAD LAYOUT
0.105
-----
V
0.075”
0.030”
-----
-----
pF
ns
R
Note
: 1. Valid provided that electrodes are kept at ambient temperature
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MCC [ Micro Commercial Components ]
