MCC
Micro Commercial Components
TM
omponents
20736 Marilla Street Chatsworth
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$% !"#
MB05S
THRU
MB10S
0.5 Amp Single Phase
Glass Passivated
Bridge Rectifier
50 to 1000 Volts
MBS -1
∼
E
∼
C
A
Notch in case
K
M
J
H
G
N
+
F
-
B
D
Features
•
•
•
Glass Passivated Diode Construction
High Temperature Soldering Guaranteed:260oC/10 Second
Saves Space On Printed Circuit Board
Mechanical Data
•
•
•
•
Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix
designates RoHS Compliant. See ordering information)
Case Material:Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Teminals: Plated leads Solderable per MIL-STD-750,Method 2026
Moisture Sensitiviy:Level
1
per J-STD-020C
MCC
Part
Number
MB05S
MB1S
MB2S
MB4S
MB6S
MB8S
MB10S
Device
Marking
MB05S
MB1S
MB2S
MB4S
MB6S
MB8S
MB10S
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
480V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25
O
C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Thermal
Resistance
Typical Junction
Capacitance
Rating For Fusing
Operating Junction
and Storage
Temperature Range
Notes:
I
F(AV)
I
FSM
0.5 A
0.8 A
(3)
35A
(2)
See Fig.1
8.3ms, half sine
+
-
Case Style
.275
6
.165
.195
.031
.106
.008
.043
.062
.205
.049
.016
6.40
3.80
4.55
0.50
2.30
0.10
0.70
1.47
4.95
0.99
0.15
~
~
V
F
1.0V
I
FM
= 0.4A;
T
A
= 25
O
C
T
A
= 25
C
O
T
A
= 125
C
per leg
O
I
R
5uA
100uA
85
O
C
/W
(2)
O
70
C
/W
(3)
20
O
C
/W
(2)
13pF
5.0A
2
s
-55to+150
O
R
thJA
R
thJA
R
thJL
C
J
I
2
t
T
J
T
STG
Measured at
1.0MHz, V
R
=4.0V
t<8.30ms
C
D
M
N
.252
.150
.179
.019
.090
.004
.027
.058
.195
.039
.006
7.00
2.70
4.20
4.95
0.80
2.70
0.20
1.10
1.57
5.21
1.24
0.41
Mounting Pad Layout
0.023 MIN.
(0.58 MIN.)
C
1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
2.
On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads
3.
On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted
on 0.05 x 0.05”(1.3x 1.3mm) solder pad
0.272 MAX.
(6.91 MAX.)
0.030 MIN.
(0.76 MIN.)
0.105 (2.67)
0.095 (2.41)
Revision:
12
www.mccsemi.com
1 of 3
2009/10/22
MCC [ Micro Commercial Components ]
