MCC
Features
•
x
x
•
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TM
Micro Commercial Components
omponents
20736 Marilla
Street Chatsworth
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$% !"#
S10A
THRU
S10M
10 Amp
Silicon Rectifier
50 to 1000 Volts
DO-214AB
(HSMC) (Round Lead)
H
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low Thermal Resistance
High Temp Soldering: 260qC for 10 Seconds At Terminals
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Thermal Resistance: 10qC/W Junction To
Case
Maximum Ratings
x
x
Operating Temperature: -55qC to +150qC
Storage Temperature: -55qC to +150qC
MCC
Part
Number
S10A
S10B
S10D
S10G
S10J
S10K
S10M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Cathode Band
Device
Marking
S10A
S10B
S10D
S10G
S10J
S10K
S10M
J
A
C
E
F
G
D
B
Electrical Characteristics @ 25qC Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Note:
DIMENSIONS
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
.200
.177
.002
---
.047
.168
.309
.239
.234
MAX
.214
.203
.005
.02
.056
.179
.322
.243
.240
MM
MIN
5.08
4.70
.05
---
1.20
4.27
7.85
6.08
5.95
MAX
5.43
5.30
.13
.51
1.42
4.55
8.18
6.18
6.10
NOTE
I
F(AV)
I
FSM
10.0A
200A
T
c
= 75qC
8.3ms, half sine
I
FM
= 10.0A;
T
J
= 25qC*
V
F
1.20V
SUGGESTED SOLDER
PAD LAYOUT
0.190
I
R
10PA
T
J
= 25qC
0.200”
*Pulse test: Pulse width 200
Psec,
Duty cycle 2%
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070”
www.mccsemi.com
Revision:
B
1
of
4
2011/06/01
MCC [ Micro Commercial Components ]
