1Gb : x4, x8, x16 DDR3 SDRAM
Pa cka g e Dim e n sio n s
Pa cka g e Dim e n sio n s
Fig u re 9:
78-Ba ll FBGA – x4, x8; “ JP”
0.8 ±0.1
Seating
plane
0.12 A
A
8 ±0.15
78X Ø0.45
Dimensions apply
to solder balls post-
reflow on Ø0.33
Ball A1 ID
Ball A1 ID
9
8
7
3
2
1
NSMD ball pads.
A
B
C
D
E
F
0.8 TYP
9.6
CTR
G
H
J
11.5 ±0.15
K
L
M
N
0.8
TYP
1.2 MAX
0.25 MIN
6.4 CTR
Notes: 1. All dimensions are in millimeters.
PDF: 09005aef826aa906/Source: 09005aef82a357c3
1Gb_DDR3_D2.fm - Rev. D 8/1/08 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2006 Micron Technology, Inc. All rights reserved.
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