Micrel, Inc.
Precision Edge
®
SY58012U
16-PIN
MicroLeadFrame
®
(MLF-16)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
V
EE
Heavy Copper Plane
V
EE
Heavy Copper Plane
PCB Thermal Consideration for 16-Pin MLF
®
Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
Note 1. Package meets Level 2 qualification.
Note 2. All parts are dry-packaged before shipment.
Note 3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131
TEL
USA
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
M9999-020207
hbwhelp@micrel.com or (408) 955-1690
9
MICREL [ MICREL SEMICONDUCTOR ]
