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MCP4331-104E/ML 参数 Datasheet PDF下载

MCP4331-104E/ML图片预览
型号: MCP4331-104E/ML
PDF下载: 下载PDF文件 查看货源
内容描述: 7/8位四路SPI数字电位器具有易失性存储器 [7/8-Bit Quad SPI Digital POT with Volatile Memory]
分类和应用: 电位器存储
文件页数/大小: 88 页 / 5263 K
品牌: MICROCHIP [ MICROCHIP TECHNOLOGY ]
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MCP433X/435X
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Absolute Maximum Ratings †
Voltage on V
DD
with respect to V
SS
..... -0.6V to +7.0V
Voltage on CS, SCK, SDI, SDI/SDO, and
RESET with respect to V
SS .....................
-0.6V to 12.5V
Voltage on all other pins (PxA, PxW, PxB and
SDO) with respect to V
SS ...............
-0.3V to V
DD
+ 0.3V
Input clamp current, I
IK
(V
I
< 0, V
I
> V
DD
, V
I
> V
PP ON
HV pins) ........... ±20 mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
) ....................................... ±20 mA
Maximum output current sunk by any Output pin
........................................................................... 25 mA
Maximum output current sourced by any Output pin
........................................................................... 25 mA
Maximum current out of V
SS
pin ...................... 100 mA
Maximum current into V
DD
pin ......................... 100 mA
Maximum current into P
X
A, P
X
W and P
X
B pins
±2.5 mA Storage temperature ........... -65°C to +150°C
Ambient temperature with power applied
.......................................................... -40°C to +125°C
Package power dissipation
(T
A
= +50°C, T
J
= +150°C) TSSOP-14 ......... 1000 mW
TSSOP-20......................................................1110 mW
QFN-20 (4x4) ................................................ 2320 mW
Soldering temperature of leads
(10 seconds) .................................................... +300°C
ESD protection on all pins
4
kV (HBM),
................................................................
300V
(MM)
Maximum Junction Temperature (T
J
) .............. +150°C
2010 Microchip Technology Inc.
DS22242A-page 3