MCP454X/456X/464X/466X
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
Voltage on V
DD
with respect to V
SS
............... -0.6V to +7.0V
Voltage
on HVC/A0, A1, A2, SCL, SDA, and WP
with
respect to V
SS .............................................................
-0.6V to 12.5V
Voltage on all other pins (PxA, PxW, and PxB)
with respect to V
SS .........................................
-0.3V to V
DD
+ 0.3V
Input clamp current, I
IK
(V
I
< 0, V
I
> V
DD
, V
I
> V
PP ON
HV pins) ......................±20 mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
) ..................................................±20 mA
Maximum output current sunk by any Output pin
......................................................................................25 mA
Maximum output current sourced by any Output pin
......................................................................................25 mA
Maximum current out of V
SS
pin .................................100 mA
Maximum current into V
DD
pin ....................................100 mA
Maximum current into P
X
A, P
X
W & P
X
B pins ............±2.5 mA
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
-40°C to +125°C
Total power dissipation (Note
1)
................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins
.................................. ≥
4 kV (HBM),
..........................................................................
≥
300V (MM)
Maximum Junction Temperature (T
J
) ......................... +150°C
Note 1:
Power dissipation is calculated as follows:
P
DIS
= V
DD
x {I
DD
-
∑
I
OH
} +
∑
{(V
DD
-V
OH
) x I
OH
} +
∑(V
OL
x I
OL
)
©
2008 Microchip Technology Inc.
DS22107A-page 3