MCP6231/2
5-Lead Small Outline Transistor Package (SC-70)
E
E1
D
p
B
n
1
Q1
c
A1
L
Units
Dimension Limits
n
p
A
A2
A1
E
E1
D
L
Q1
c
B
INCHES
NOM
5
.026 (BSC)
MILLIMETERS*
MIN
NOM
5
0.65 (BSC)
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
A2
A
MIN
MAX
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Top of Molded Pkg to Lead Shoulder
Lead Thickness
Lead Width
.031
.031
.000
.071
.045
.071
.004
.004
.004
.006
.043
.039
.004
.094
.053
.087
.012
.016
.007
.012
1.10
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
DS21881B-page 12
2004 Microchip Technology Inc.
MICROCHIP [ MICROCHIP TECHNOLOGY ]
