PIC16F62X
19.0
19.1
PACKAGING INFORMATION
Package Marking Information
18-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCDE
18-Lead SOIC (.300")
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
Example
PIC16F627
-04I / P456
9923 CBA
Example
PIC16F627
-04I / S0218
9918 CDK
20-Lead SSOP
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
Example
PIC16F627
-04I / 218
9951 CBP
Legend:
MM...M
XX...X
AA
BB
C
D
E
Note:
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
©
1999 Microchip Technology Inc.
Preliminary
DS40300B-page 147
MICROCHIP [ MICROCHIP TECHNOLOGY ]
