MMAD1109 and MMAD1109e3
Switching Diode Array
Steering Diode TVS Array™
SCOTTSDALE DIVISION
DESCRIPTION
These low capacitance diode arrays are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 14-PIN package
for use as steering diodes protecting up to seven I/O ports from ESD, EFT,
or surge by directing them either to the positive side of the power supply
line or to ground (see figure 1). An external TVS diode may be added
between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver
applications. This includes computers and peripheral equipment such as
magnetic cores, thin-film memories, plated-wire memories, etc., as well as
decoding or encoding applications. These arrays offer many advantages of
integrated circuits such as high-density packaging and improved reliability.
This is a result of fewer pick and place operations, smaller footprint, smaller
weight, and elimination of various discrete packages that may not be as
user friendly in PC board mounting. They are available with either Tin-Lead
plating terminations or as RoHS Compliant with annealed matte-Tin finish
by adding an “e3” suffix to the part number.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
APPEARANCE
WWW .
Microsemi
.C
OM
Top Viewing Pin Layout
FEATURES
•
•
•
•
•
•
•
7 Diode Array / protects 7 lines
Molded 14-Pin SOIC Package
UL 94V-0 Flammability Classification
Low Capacitance 1.5 pF per diode
Switching speeds less than 5 ns
RoHS Compliant devices available by adding “e3” suffix
IEC 61000-4 compatible
61000-4-2 (ESD): Air 15kV, contact – 8 kV
61000-4-4 (EFT): 40A – 5/50 ns
61000-4-5 (surge): 12A, 8/20
µs
APPLICATIONS / BENEFITS
•
Low capacitance steering diode protection for high
frequency data lines
•
RS-232 & RS-422 Interface Networks
•
Ethernet: 10 Base T
•
Computer I / O Ports
•
LAN
•
Switching Core Drivers
MAXIMUM RATINGS
•
•
•
•
•
•
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20
µs
)
Continuous Forward Current: 400 mA (one diode)
Power Dissipation (P
D
): 1500 mW (total)
Solder Temperature: 260°C for 10 s (maximum)
MECHANICAL AND PACKAGING
•
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0 flammability
classification
•
TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750 method 2026
•
MARKING: MSC logo, MMAD1107 or MMAD1107e3
and date code. Pin #1 is to the left of the dot or
indent on top of package
•
WEIGHT: 0.127 grams (approximate)
•
Tape & Reel packaging: 2500 pcs (STANDARD)
•
Carrier tube packaging: 55 pcs
MMAD1109, e3
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
BREAKDOWN
VOLTAGE
V
BR
@ I
BR
=100µA
V
MIN
MMAD1109
MMAD1109e3
90
WORKING
PEAK
REVERSE
VOLTAGE
V
RWM
V
MAX
75
LEAKAGE
CURRENT
I
R
T
A
= 25°C
µA
MAX
0.200
@V
R
20
MAX
300
LEAKAGE
CURRENT
I
R
T
A
= 150°C
µA
@V
R
20
CAPACITANCE
C
@0V
pF
TYP
1.5
REVERSE
RECOVERY
TIME
t
rr
ns
MAX
5.0
FORWARD
VOLTAGE
V
F
I
F
= 10 mA
V
MAX
1.00
FORWARD
VOLTAGE
V
F
I
F
= 100 mA
V
MAX
1.20
PART
NUMBER
Copyright
©
2005
6-28-2005 REV K
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
MICROSEMI [ MICROSEMI CORPORATION ]
