P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
UC184xA/284xA/384xA
C U R R E N T M O D E P W M C O N T R O L L E R
P R O D U C T I O N D A T A S H E E T
ABSOLUTE MAXIMUM RATINGS (Note 1)
PACKAGE PIN OUTS
Supply Voltage (Low Impedance Source) (VCC) ......................................................... 30V
Supply Voltage (ICC < 30mA).......................................................................... Self Limiting
Output Current............................................................................................................. ±1A
Output Energy (Capacitive Load)................................................................................. 5µJ
Analog Inputs (VFB & ISENSE) ........................................................................ -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at TA = 25°C (M Package).............................................................. 1W
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds)............................................................. 300°C
COMP
VFB
ISENSE
RT/CT
1
2
3
4
8
7
6
5
VREF
VCC
OUTPUT
GND
M & Y PACKAGE
(Top View)
1
2
3
4
8
7
6
5
COMP
VFB
ISENSE
RT/CT
VREF
VCC
OUTPUT
GND
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
DM PACKAGE
(Top View)
THERMAL DATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
95°C/W
165°C/W
120°C/W
130°C/W
1
2
3
4
5
6
7
14
13
12
11
10
9
COMP
N.C.
VFB
N.C.
ISENSE
N.C.
RT/CT
VREF
N.C.
VCC
VC
OUTPUT
GND
PWR GND
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Y PACKAGE:
8
D PACKAGE
(Top View)
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θ numbers are guidelines for the thermal performance of the device/pc-board system.
All ofJtAhe above assume no ambient airflow
Copyright © 1995
Rev. 1.2 12/95
2
MICROSEMI [ Microsemi ]
