This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
Active
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ")
Documents:
Series
image - Reference only
LR19980
E29179
ELV and RoHS
Compliant
Contains SVHC: No
Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Agency Certification
CSA
UL
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
Style
Backplane Connectors
Backplane
Backplane Power Module
Power Header
HDM®
N/A
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
3
3
Black
250
No
94V-0
No
None
Beryllium Copper
Gold
Gold
High Temperature Thermoplastic
1
Open Pin Field
3
Vertical
Yes
0.098 In
2.50 mm
Tube
0.138 In
3.50 mm
30
0.75
2
0.05
No
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Search Parts in this Series
Mates With
Daughterboard Power Module
Application Tooling
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
Flat Rock Tooling for 0622013700
Pneumatic Press
HDM® Backplane
Power Module
Loading Heads
MOLEX [ Molex Electronics Ltd. ]
