1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
Features and Benefits continued
• 3 GHz performance
• Cross Talk < 7%
• 6.00 to 16.00mm stack heights
• Economical design
• For 50 and 100 Ohm applications
• Anti-flux design
• Metal solder tabs provide PCB hold down
and strain relief for SMT tails
• Polarizing pegs assist placement
• Housing lock on 20 to 60 circuits
• Superior terminal design/wipe length
• Easy board processing
• Advanced gold-plated housings with
integrated shielding system
• Two points of contact on each signal
• Multiple stack heights from 10 to25mm
(.394 to .984")
• Available in 6, 12, 24, and 36 differential
pair sizes (12, 24, 48 and 72 contacts)
• Up to 32mm board-to-board stack heights
• For parallel board packaging
• Available in press-fit or solder tail
• For Mezzanine cards, parallel backplanes
and bridge board applications
• End walls facilitate blind mating
• Surface Mount Compatible
• High-density 2.00mm metric connector in
the same form factor as Future bus
• 6-row 2mm connector provides 30
contacts per linear centimeter (> 75/inch)
• Designed for high-density, high-speed
applications
• Modular components for design flexibility;
72 position (6 row by 12) and 144 position
(6 row by 24) modules
• Tail lengths available in 0.5mm
increments to optimize PCB thickness
Applications continued
• Mobile Phone
• PDA
• Digital Video Camera
• Digital Still Camera
• Digital Video Player
• Digital Audio Player
• Voice Recorder
• Notebook PC
• Any Compact Applications
• Switches and Hubs
• Routers
• Servers and Blade Servers
• Workstations
• Storage Devices
• High-End Computer
• Storage
• Telecom (General)
• Broadcast Equipment
• Telecom Infrastructure
• Networking
• Telecom (Home/Office)
Features and Benefits continued
Applications continued
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
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