Freescale Semiconductor
Technical Data
MPXC2011DT1
Rev. 3, 10/2004
High Volume Sensor for
Low Pressure Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure
sensor package which is ideal as a sub--module component or a disposable unit. The
unique concept of the Chip Pak allows great flexibility in system design while allowing an
economic solution for the designer. This new chip carrier package uses Freescale
Semiconductor’s unique sensor die with its piezoresistive technology, along with the
added feature of on--chip, thin--film temperature compensation and calibration.
NOTE:
Freescale Semiconductor is also offering the Chip Pak package in
application--specific configurations, which will have an “SPX” prefix, followed by a
four--digit number, unique to the specific customer.
Features:
•
Low Cost
•
Integrated Temperature Compensation and Calibration
•
Ratiometric to Supply Voltage
•
Polysulfone Case Material (Medical, Class V Approved)
•
Provided in Easy--to--Use Tape and Reel
Application Examples
•
Respiratory Diagnostics
•
Air Movement Control
•
Controllers
•
Pressure Switching
NOTE:
The die and wire bonds are exposed on the front side of the Chip Pak
(pressure is applied to the backside of the device). Front side die and wire protection
must be provided in the customer’s housing. Use caution when handling the devices
during all processes.
Freescale Semiconductor ’s MPXC2011DT1/
MPXC2012DT1 Pressure Sensor
has been designed for
medical usage by combining the performance of Freescale
Semiconductor’s shear stress pressure sensor design and
the use of biomedically approved materials. Materials with a
proven history in medical situations have been chosen to
provide a sensor that can be used with confidence in
applications, such as invasive blood pressure monitoring. It
can be sterilized using ethylene oxide. The portions of the
pressure sensor that are required to be biomedically
approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
MPXC2011DT1
MPXC2012DT1
Freescale Semiconductor Preferred Device
PRESSURE SENSORS
0 to 75 mmHg (0 to 10 kPa)
CHIP PAK PACKAGE
MPXC2011DT1/MPXC2012DT1
CASE 423A
PIN NUMBER
1
2
Gnd
S+
3
4
V
S
S--
The
MPXC2011DT1
contains a silicone dielectric gel
which covers the silicon piezoresistive sensing element. The
gel is a nontoxic, nonallergenic elastomer system which
meets all USP XX Biological Testing Class V requirements.
The properties of the gel allow it to transmit pressure uni-
formly to the diaphragm surface, while isolating the internal
electrical connections from the corrosive effects of fluids,
such as saline solution. The gel provides electrical isolation
sufficient to withstand defibrillation testing, as specified in the
proposed Association for the Advancement of Medical
Instrumentation (AAMI) Standard for blood pressure trans-
ducers. A biomedically approved opaque filler in the gel pre-
vents bright operating room lights from affecting the
performance of the sensor.
The
MPXC2012DT1
is a no--gel option.
Preferred
devices are Freescale Semiconductor recommended choices for future use and best overall value.
©
Freescale Semiconductor, Inc., 2004. All rights reserved.
MPXC2011DT1 MPXC2012DT1
1
Sensor Device Data
Freescale Semiconductor
MOTOROLA [ MOTOROLA, INC ]
