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MTP2P50 参数 Datasheet PDF下载

MTP2P50图片预览
型号: MTP2P50
PDF下载: 下载PDF文件 查看货源
内容描述: TMOS功率场效应晶体管2.0安培500伏的RDS(on ) = 6.0 OHM [TMOS POWER FET 2.0 AMPERES 500 VOLTS RDS(on) = 6.0 OHM]
分类和应用: 晶体晶体管功率场效应晶体管
文件页数/大小: 8 页 / 233 K
品牌: MOTOROLA [ MOTOROLA, INC ]
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MTP2P50E/D
Data Sheet
TMOS E-FET.
Power Field Effect Transistor
Designer's
MTP2P50E
Motorola Preferred Device
P–Channel Enhancement–Mode Silicon Gate
This high voltage MOSFET uses an advanced termination
scheme to provide enhanced voltage–blocking capability without
degrading performance over time. In addition, this advanced TMOS
E–FET is designed to withstand high energy in the avalanche and
commutation modes. The new energy efficient design also offers a
drain–to–source diode with a fast recovery time. Designed for high
voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Robust High Voltage Termination
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
IDSS and VDS(on) Specified at Elevated Temperature
G
S
TMOS POWER FET
2.0 AMPERES
500 VOLTS
RDS(on) = 6.0 OHM
®
D
CASE 221A–06, Style 5
TO–220AB
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Drain–Source Voltage
Drain–Gate Voltage (RGS = 1.0 MΩ)
Gate–Source Voltage — Continuous
Gate–Source Voltage
— Non–Repetitive (tp
10 ms)
Drain Current — Continuous
Drain Current
— Continuous @ 100°C
Drain Current
— Single Pulse (tp
10
µs)
Total Power Dissipation
Derate above 25°C
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, IL = 4.0 Apk, L = 10 mH, RG = 25
Ω)
Thermal Resistance — Junction to Case
Thermal Resistance
— Junction to Ambient
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds
Symbol
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
TJ, Tstg
EAS
R
θJC
R
θJA
TL
Value
500
500
±
20
±
40
2.0
1.6
6.0
75
0.6
– 55 to 150
80
1.67
62.5
260
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
W/°C
°C
mJ
°C/W
°C
Designer’s Data for “Worst Case” Conditions
— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 1
©
Motorola TMOS
Motorola, Inc. 1995
Power MOSFET Transistor Device Data
1