BNX
BNX022
BNX023
BNX024
BNX025
Block Type EMIFILr
SMD Type
Soldering and Mounting
1. Standard Land Pattern Dimensions
Chip Ferrite Bead
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
0
CG
B
CB
PSG
CG
CG
o
PCB Warping (for BNX02p)
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
a
b
2. Solder Paste Printing and Adhesive Application
When reflow soldering the
block type EMIFILr,
the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
Series
Solder Paste Printing
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
Adhesive Application
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
0
3.8
5.8
CG
B
PSG
CG
10.3
13.7
17.5
CB
CG
!Note
• Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
C31E.pdf
Mar.28,2011
197
Soldering
and Mounting
Block Type EMIFILr
BNX022
BNX023
BNX024
BNX025
oGuideline
of solder paste thickness:
150-200µm
Chip Common Mode Choke Coil
Poor example
Good example
Chip EMIFILr
(1) A double-sided print board (or multilayer board) as shown in
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(2) This product has large rated current of 10A/15A. Please
consider real current and make Cu electrode thick enough.
(Please design line resistance suitable for real current)
(3) Please drop CG on a ground electrode on the back layer
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
(4) It is recommended to use a double-sided printed circuit
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
(5) The ground pattern should be designed to be as large as
possible to achieve maximum filtering performance.
10.3
13.2
13.7
17.5
0
3.8
5.8
MURATA [ MURATA MANUFACTURING CO., LTD. ]
