A p p l i c At i o n S p E c i F i c c A pA c i t o R S
High Frequency Ceramic Capacitors
ERB Specifications and Test Methods
Specifications and Test Methods
Item
Specifications and Test Methods
Operating Temperature
Appearance
Dimension
Dielectric Strength
ERB Series
Test Method
Reference Temperature: 25
Visual inspection.
Using calipers.
300%* of the rated voltage
*250V/300V: 250%, 500V: 200%
DC voltage not exceeding the rated voltage at 25°C
and 75%RH max. and within 2 minutes of charging.
Frequency 1±0.1MHz
Voltage 1±0.2Vrms
Specifications
55°C to 125°C
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
1,000,000M min.(C 470pF)
Insulation Resistance
100,000 M min. (C 470pF)
C: Nominal capacitance (pF)
C 220pF: Q 10,000
220pF
470pF
C 470pF: Q 5,000
C 1000pF: Q 3,000
Q
Specifications and Test Methods
C: Nominal capacitance (pF)
ERB Series
Test Method
Solder the capacitor to the test jig (glass epoxy
the
The temperature coefficient is determined using
board) then apply 10N force parallel with the
capacitance measured in step
Reference Temperature: 25 in
3 as a reference.
test
When cycling the
jig
for 10±1sec.
temperature sequentially from
Visual inspection.
the capacitance should be within
step 1 through 5
the specified tolerance for the temperature coefficient
Using calipers.
and capacitance
from 10 to 55Hz
A-1. The
Frequency range,
change as in Table
and return to
300%*should
drift
traversed in approximately 1 minute.
capacitance
be
is calculated by dividing the
10Hz, of the rated voltage
*250V/300V:should be applied for a period of 2 hours
differences
250%,
the maximum
This motion
between
500V: 200%
and minimum
measured values in steps 1, 3 and 5 by the cap.
in each
of
3 mutually perpendicular directions total of
value in
DC voltage not exceeding the rated voltage at 25°C
6
hours).
step 3.
and 75%RH max. and
Temperature (°C)
of charging.
within 2 minutes
Step
25±2
-55±3
3
25±2
Voltage 1±0.2Vrms solder solution for 5±0.5 seconds
Immerse in eutectic
4
125±3
at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for
5
5±0.5 seconds at 245±5°C.
25±2
Capacitance
Adhesive Strength of
Operating Temperature
Temperature
Termination
Characteristics
Appearance
Dimension
Dielectric Strength
Vibration Resistance
Insulation Resistance
Deflection
Q
Solderability of Termination
Item
Capacitance
the terminations or other
No removal of
Change:
55°C to
specified tolerance. (Table A-1)
Within the
125°C
defect should occur.
Temperature Coefficent:
No defects or abnormalities.
Within the specified tolerance. (Table A-1)
Capacitance Drift:
dimensions.
Within the specified
Within ±0.2% or
Appearance: No defects or abnormalities.
±0.5pF (Whichever
the specified tolerance.
Capacitance: Within
is larger)
No 220pF: Q 10,000
C defects or abnormalities.
220pF C 470pF: Q 5,000
1,000,000M1000pF: Q 3,000
470pF C min.(C 470pF)
Specifications
100,000 M capacitance (pF)
C: Nominal min. (C 470pF)
C: Nominal capacitance (pF)
No crack or 10,000
C 220pF: Qmarked defect should occur.
220pF C 470pF: Q 5,000
95% of the terminations
are
to be soldered
470pF C 1000pF: Q 3,000
evenly and continuously.
C: Nominal capacitance (pF)
ERB Series
Flexure: 1mm
Frequency 1±0.1MHz
2
1
Appearance: No marking defects
No removal of the terminations or other
Capacitance occur.
defect shouldChange: Within ±2.5% or
±0.25 pF (Whichever is larger)
Resistance to Soldering Heat C 220pF: Q 10,000
Appearance: No defects or abnormalities.
220pF C 470pF: Q 5,000
Capacitance: Within the specified tolerance.
470pF C 1000pF:
C 220pF: Q 10,000Q 3,000
Vibration Resistance
C: Nominal capacitance (pF)
220pF C 470pF: Q 5,000
Adhesive Strength of
Termination
470pF C 1000pF: Q 3,000
Appearance: No marking defects
C: Nominal capacitance (pF) ±5% or
Capacitance Change: Within
Solder the capacitor to the test jig (glass epoxy
board) then apply 10N force in parallel with the test
jig
for 10±1sec.
Immerse the capacitor in a eutectic solder solution or
Sn-3.0Ag-0.5Cu solder solution at 270±5°C for
10±0.5 seconds. Let sit at room temperature for
Frequency range, from 10 to 55Hz and return to
24±2 hours.
10Hz, should be traversed in approximately 1 minute.
This motion should be applied for a period of 2 hours
in each
of
3 mutually perpendicular directions total of
6
hours).
Flexure: 1mm
55 to 125 Five cycles
Immerse in eutectic solder solution for 5±0.5 seconds
at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for
5±0.5 seconds at 245±5°C.
Deflection
Temperature Cycle
Solderability of Termination
±0.5 pF (Whichever is larger)
No 220pF: Qmarked defect should occur.
C crack or 10,000
220pF C 470pF: Q 5,000
95% of the terminations
are
to be soldered
470pF C 1000pF: Q 3,000
evenly and continuously.
C: Nominal capacitance (pF)
Appearance: No marking defects
Capacitance Change: Within ±2.5% or
±5% or
±0.25 pF (Whichever is larger)
±0.5pF (Whichever is larger)
C 220pF: Q350
30pF: Q 10,000
Resistance to Soldering Heat
Humidity Steady State
220pF C<30pF: Q 275+ 5°C/2°C 10pF:
C 470pF: Q 5,000
10pF
470pF C 1000pF: Q 3,000
Q 200+10C
C: Nominal capacitance (pF)
Appearance: No marking defects
±3%
Capacitance Change: Within ±5% or
±0.3pF (Whichever is larger)
±0.5 pF(Whichever is larger)
30pF: Q 10,000
C 220pF: Q350
10pF
220pF C<30pF: Q 275+5°C/2°C
C 470pF: Q 5,000
10pF: C 200+10°C
470pF Q 1000pF: Q 3,000
C: Nominal capacitance (pF)
Appearance: No marking defects
Capacitance Change: Within ±5% or
w
larger)
±0.5pF (Whichever is
w w . m
C 30pF: Q 350
Immerse the capacitor in a eutectic solder solution or
Sn-3.0Ag-0.5Cu solder (-10 to +65270±5°C for
Apply the 24-hour heat solution at ) and humidity
10±0.5 seconds. Let sit 10 room temperature for
(80 to 100%) treatment, at consecutive times.
24±2 hours.
High Temperature
Temperature CycleLoad
Apply 200% (500V only 150%) of the rated voltage
for55 to 125 Five the maximum operating
1000±12 hours at cycles
temperature ±3°C.
52 – Innovator in Electronics
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Humidity Steady State
Apply the 24-hour heat (-10 to +65 ) and humidity
(80 to 100%) treatment, 10 consecutive times.
C-29-C
MURATA [ MURATA MANUFACTURING CO., LTD. ]
