Molded Chip Wirewound Inductors
PACKAGING SPECIFICATIONS
t1
Perforation1.5φ±0.1
NIN Series
F
A
t2
B
E
P
4.0
±0.1
CARRIER TAPE DIMENSIONS (mm)
Case
Code
B
C
D
Type
FC/NC/PC
FA/NA/PA
FB
Size
C
A
B
W ±0.3
8.0
8.0
12.0
A ±0.2
2.4
2.8
3.6
B ±0.2
2.9
3.6
4.9
P ±0.1
4.0
4.0
8.0
E ±0.1
1.75
1.75
1.75
F ±0.1
3.5
3.5
5.5
t1
0.25
0.25
0.3
t2
1.85
2.4
3.5
2.0
±
0.5
W
DIMENSIONS (mm)
Case
Code
B
C
D
Type
FC/NC/PC
FA/NA/PA
FB
Size
C
A
B
D∅ ±2
180
180
180
W ±1.5
9.0
9.0
13.0
Qty/Reel
2000 pcs
2000 pcs
500 pcs
2.0
±
0.5
±
21
0.
8
50φ
Min.
13φ
±0.5
W
RECOMMENDED LAND PATTERNS FOR FLOW AND REFLOW SOLDERING
NIN Chip
Land Pattern
C
DIMENSIONS (mm)
Type
B
C
D
FC/NC/PC
FA/NA/PA
FB
Size
C
A
B
A
1.4~1.5
1.6~2.0
2.4~2.6
B
3.5~4.0
4.0~4.6
5.5~6.0
C
1.2~1.6
1.9~2.4
2.0~3.0
A
B
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Dφ
37