CF5035 series
PAD LAYOUT
(Unit: µm)
VDD
7
TEST
6
Q
5
(1080,1320)
Y
1
2
3
4
(0,0)
INHN XIN XOUT VSS
X
Chip size: 1.08 × 1.32mm
Chip thickness: 300 30ꢀm
PAD size: 100ꢀm × 100ꢀm (TEST: 80ꢀm × 80ꢀm)
Chip base: V potential
SS
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
No.
Name
I/O
Description
X
Y
Output state control input. Oscillator stops when LOW.
Power-saving pull-up resistor built-in.
1
INHN
I
205
135
2
3
4
5
6
7
XIN
XOUT
VSS
Q
I
O
–
O
I
Oscillator input
461
734
945
945
494
135
135
135
Crystal connection pins.
Crystal is connected between XIN and XOUT.
Oscillator output
(–) ground
135
Output. Output frequency. High impedance in standby mode
Test (leave open)
1185
1195
1185
TEST
VDD
–
(+) supply voltage
BLOCK DIAGRAM
VDD VSS
INHN
XIN
Rf
CMOS
Q
COUT
CIN
XOUT
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
