欢迎访问ic37.com |
会员登录 免费注册
发布采购

M25P80-VMN6TP 参数 Datasheet PDF下载

M25P80-VMN6TP图片预览
型号: M25P80-VMN6TP
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位,低电压,串行闪存与75 MHz的SPI总线接口 [8 Mbit, low voltage, serial Flash memory with 75 MHz SPI bus interface]
分类和应用: 闪存存储内存集成电路光电二极管时钟
文件页数/大小: 52 页 / 995 K
品牌: NUMONYX [ NUMONYX B.V ]
 浏览型号M25P80-VMN6TP的Datasheet PDF文件第44页浏览型号M25P80-VMN6TP的Datasheet PDF文件第45页浏览型号M25P80-VMN6TP的Datasheet PDF文件第46页浏览型号M25P80-VMN6TP的Datasheet PDF文件第47页浏览型号M25P80-VMN6TP的Datasheet PDF文件第48页浏览型号M25P80-VMN6TP的Datasheet PDF文件第49页浏览型号M25P80-VMN6TP的Datasheet PDF文件第51页浏览型号M25P80-VMN6TP的Datasheet PDF文件第52页  
Revision history  
M25P80  
13  
Revision history  
Table 21. Document revision history  
Date  
Revision  
Changes  
Document released as a Product Preview data sheet  
Clarification of descriptions of entering Standby Power mode from Deep  
Power-down mode, and of terminating an instruction sequence or data-out  
sequence.  
24-Apr-2002  
1.0  
VFQFPN8 package (MLP8) added. Order code (MW) corrected on page 1  
for SO8 package. Document promoted to Preliminary Data.  
27-Sep-2002  
13-Dec-2002  
1.1  
1.2  
Typical Page Program time improved. Write Protect setup and hold times  
specified, for applications that switch Write Protect to exit the Hardware  
Protection mode immediately before a WRSR, and to enter the Hardware  
Protection mode again immediately after.  
Table of contents, warning about exposed paddle on MLP8, and Pb-free  
options added.  
24-Oct-2003  
2.0  
40MHz AC Characteristics table included as well as 25MHz. Change of  
naming for VDFPN8 package. Document promoted to full datasheet  
24-Nov-2003  
21-Apr-2004  
2.1  
3.0  
Improvement to description of reading the 8-bit electronic signature.  
SO16 package added. SO8W package removed. Soldering temperature  
information clarified for RoHS compliant devices. Device Grade clarified  
07-May-2004  
18-May-2004  
4.0  
5.0  
Automotive range added  
SO8W package re-instated, but under limited availability  
Data-retention measurement temperature corrected. Details of how to find  
the date of marking added.  
05-Aug-2004  
01-Aug-2005  
6.0  
7.0  
Updated Page Program (PP) instructions in Page Programming, Page  
Program (PP), Instruction times and Instruction Times (Device Grade 3).  
SO16 package removed. All packages are ECOPACK®. MLP8 package  
renamed as VFQFPN8. Plating technology clarified in Table 20: Ordering  
information scheme. VFQFPN silhouette modified (see silhouette on page  
1). tSHQZ timing modified in Figure 25: Output timing.  
20-Oct-2005  
8.0  
Device grade 3 specifications removed from datasheet. Data retention  
conditions changed in Table 11: Data retention and endurance.  
Figure 3: Bus Master and memory devices on the SPI bus modified and  
Note 2 added.  
13-Apr-2006  
20-Jul-2006  
9
Note 2 added below Figure 26 and Note 2 added below Figure 27.  
Note on SO8 package removed below Table 20: Ordering information  
scheme.  
10  
SO8N package added (see Figure 28 and Table 19).  
50/52