NXP Semiconductors
PCA9554/PCA9554A
8-bit I
2
C-bus and SMBus I/O port with interrupt
I
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
I
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I
Packages offered: DIP16, SO16, SSOP16, SSOP20, TSSOP16,
HVQFN16 (2 versions: 4
×
4
×
0.85 mm and 3
×
3
×
0.85 mm), and bare die
3. Ordering information
Table 1.
Ordering information
T
amb
=
−
40
°
C to +85
°
C.
Type number
PCA9554N
PCA9554AN
PCA9554D
PCA9554AD
PCA9554DB
PCA9554ADB
PCA9554TS
PCA9554ATS
PCA9554PW
PCA9554APW
PCA9554BS
PCA9554ABS
PCA9554BS3
PCA9554ABS3
PCA9554U
Topside mark
PCA9554N
PCA9554AN
PCA9554D
PCA9554AD
9554DB
9554A
PCA9554
PA9554A
9554DH
9554ADH
9554
554A
P54
54A
-
bare die
HVQFN16
HVQFN16
TSSOP16
SSOP20
SSOP16
SO16
Package
Name
DIP16
Description
plastic dual in-line package; 16 leads (300 mil);
long body
plastic small outline package; 16 leads;
body width 7.5 mm
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic shrink small outline package; 20 leads;
body width 4.4 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 4
×
4
×
0.85 mm
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3
×
3
×
0.85 mm
-
Version
SOT38-1
SOT162-1
SOT338-1
SOT266-1
SOT403-1
SOT629-1
SOT758-1
-
PCA9554_9554A_7
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 07 — 13 November 2006
2 of 30
PHILIPS [ NXP SEMICONDUCTORS ]
