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1SMB5920BT3 参数 Datasheet PDF下载

1SMB5920BT3图片预览
型号: 1SMB5920BT3
PDF下载: 下载PDF文件 查看货源
内容描述: 3瓦的塑料表面贴装齐纳稳压器 [3 Watt Plastic Surface Mount Zener Voltage Regulators]
分类和应用: 稳压器二极管测试光电二极管
文件页数/大小: 6 页 / 72 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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1SMB5913BT3 Series
Preferred Device
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 3 Watt Zener diodes offers the following
advantages.
Features
http://onsemi.com
Zener Voltage Range − 3.3 V to 200 V
ESD Rating of Class 3 (>16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Side or Bottom Circuit Board Mounting
Pb−Free Packages are Available
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant and leads are
Cathode
Anode
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS:
Modified L−Bend providing more contact area to bond pads
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Maximum Steady State Power
Dissipation @ T
L
= 75°C
Measured at Zero Lead Length
Derate Above 75°C
Thermal Resistance from Junction−to−Lead
Maximum Steady State Power Dissipation
@ T
A
= 25°C (Note )
Derate Above 25°C
Thermal Resistance from Junction−to−Ambient
Operating and Storage Temperature Range
Symbol
P
D
Value
3.0
40
25
550
4.4
226
−65 to
+150
Unit
W
mW/°C
°C/W
mW
mW/°C
°C/W
°C
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
9xxB
G
G
A
= Assembly Location
Y
= Year
WW = Work Week
9xxB = Device Code (Refer to page 3)
(Note: Microdot may be in either location)
R
qJL
P
D
R
qJA
T
J
, T
stg
ORDERING INFORMATION
Device
1SMB59xxBT3
1SMB59xxBT3G
Package
SMB
SMB
(Pb−Free)
Shipping
2500/Tape & Reel
2500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 board, using recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 6
Publication Order Number:
1SMB5913BT3/D