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1SMB5919BT3 参数 Datasheet PDF下载

1SMB5919BT3图片预览
型号: 1SMB5919BT3
PDF下载: 下载PDF文件 查看货源
内容描述: 3瓦的塑料表面贴装齐纳稳压器 [3 Watt Plastic Surface Mount Zener Voltage Regulators]
分类和应用: 稳压器
文件页数/大小: 6 页 / 74 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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1SMB5913BT3 Series
Preferred Device
3 Watt Plastic Surface Mount
Zener Voltage Regulators
This complete new line of 3 Watt Zener diodes offers the following
advantages.
Specification Features
Zener Voltage Range − 3.3 V to 200 V
ESD Rating of Class 3 (>16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Side or Bottom Circuit Board Mounting
Pb−Free Packages are Available
http://onsemi.com
Mechanical Characteristics
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant and leads are
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
Cathode
Anode
260°C for 10 Seconds
LEADS:
Modified L−Bend providing more contact area to bond pads
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Maximum Steady State Power
Dissipation @ T
L
= 75°C
Measured at Zero Lead Length
Derate Above 75°C
Thermal Resistance from Junction−to−Lead
Maximum Steady State Power Dissipation
@ T
A
= 25°C (Note )
Derate Above 25°C
Thermal Resistance from Junction−to−Ambient
Operating and Storage
Temperature Range
Symbol
P
D
Value
3.0
40
25
550
4.4
226
−65
to
+150
Unit
W
mW/°C
°C/W
mW
mW/°C
°C/W
°C
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
YWW
9xxB
Y
WW
9xxB
= Year
= Work Week
= Specific Device Code
=
(See Table page 3)
R
qJL
P
D
R
qJA
T
J
, T
stg
ORDERING INFORMATION
Device
1SMB59xxBT3
1SMB59xxBT3G
Package
SMB
SMB
(Pb−Free)
Shipping
2500/Tape & Reel
2500/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. FR−4 board, within 1″ to device, using recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2004
1
September, 2004 − Rev. 4
Publication Order Number:
1SMB5913BT3/D