BD135, BD137, BD139
Plastic Medium Power
Silicon NPN Transistor
This series of plastic, medium−power silicon NPN transistors are
designed for use as audio amplifiers and drivers utilizing
complementary or quasi complementary circuits.
http://onsemi.com
Features
•
Pb−Free Packages are Available
•
DC Current Gain − h
FE
= 40 (Min) @ I
C
= 0.15 Adc
•
BD 135, 137, 139 are complementary with BD 136, 138, 140
1.5 A POWER TRANSISTORS
NPN SILICON
45, 60, 80 V, 12.5 W
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
BD135
BD137
BD139
BD135
BD137
BD139
Symbol
V
CEO
Value
45
60
80
45
60
100
5.0
1.5
0.5
1.25
10
12.5
100
– 55 to
+ 150
Unit
Vdc
3 2
1
Vdc
TO−225AA
CASE 77
STYLE 1
Collector−Base Voltage
V
CBO
MARKING DIAGRAM
Vdc
Adc
Adc
Watts
mW/°C
Watts
mW/°C
°C
xx
Y
WW
= 35, 37, 39
= Year
= Work Week
YWW
BD1xx
Emitter−Base Voltage
Collector Current
Base Current
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
V
EBO
I
C
I
B
P
D
P
D
T
J
, T
stg
ORDERING INFORMATION
Device
BD135
BD135G
BD137
Package
TO−225AA
TO−225AA
(Pb−Free)
TO−225AA
TO−225AA
(Pb−Free)
TO−225AA
TO−225AA
(Pb−Free)
Shipping
†
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
Maximum ratings are those values beyond which device damage can oc-
cur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these
limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Case
Thermal Resistance,
Junction−to−Ambient
Symbol
q
JC
q
JA
Max
10
100
Unit
°C/W
°C/W
BD137G
BD139
BD139G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
April, 2005 − Rev. 12
Publication Order Number:
BD135/D