LM311 LM211
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
8
5
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
MILLIMETERS
INCHES
1
4
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
9.40
6.10
3.94
0.38
1.02
MAX
10.16
6.60
4.45
0.51
1.78
MIN
MAX
0.400
0.260
0.175
0.020
0.070
0.370
0.240
0.155
0.015
0.040
F
–A–
NOTE 2
L
2.54 BSC
0.100 BSC
0.76
0.20
2.92
7.62 BSC
–––
1.27
0.30
3.43
0.030
0.008
0.115
0.300 BSC
–––
0.050
0.012
0.135
C
10
1.01
10
0.040
0.76
0.030
J
–T–
SEATING
PLANE
N
M
D
K
G
H
M
M
M
0.13 (0.005)
T
A
B
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE R
NOTES:
D
A
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
8
1
5
4
M
M
0.25
B
H
E
h X 45
MILLIMETERS
B
e
DIM
A
A1
B
C
D
E
e
H
h
MIN
1.35
0.10
0.35
0.18
4.80
3.80
MAX
1.75
0.25
0.49
0.25
5.00
4.00
A
C
SEATING
PLANE
L
1.27 BSC
0.10
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
L
M
S
S
0.25
C
B
A
7
MOTOROLA ANALOG IC DEVICE DATA
ONSEMI [ ONSEMI ]
