MC10EL16, MC100EL16
Table 1. PIN DESCRIPTION
PIN
D, D
Q, Q
V
BB
V
CC
V
EE
NC
EP
FUNCTION
ECL Data Inputs
ECL Data Outputs
Reference Voltage Output
Positive Supply
Negative Supply
No Connect
Exposed pad must be connected to a sufficient thermal conduit.
Electrically connect to the most negative supply or leave floating
open.
Table 2. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charge Device Model
Value
75 KW
N/A
> 500 V
> 100 V
> 2 KV
Level 1
UL 94 V−0 @ 0.125 in
47
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
Table 3. MAXIMUM RATINGS
Symbol
V
CC
V
EE
V
I
I
out
I
BB
T
A
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
T
sol
Parameter
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
V
BB
Sink/Source
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Pb
Pb−Free
0 lfpm
500 lfpm
Standard Board
0 lfpm
500lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
Condition 1
V
EE
= 0 V
V
CC
= 0 V
V
EE
= 0 V
V
CC
= 0 V
Continuous
Surge
V
I
V
CC
V
I
V
EE
Condition 2
Rating
8
−8
6
−6
50
100
±
0.5
−40
to +85
−65
to +150
190
130
41 to 44
185
140
41 to 44
±
5%
129
84
265
265
Units
V
V
V
V
mA
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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