MC10EP105, MC100EP105
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A−02
ISSUE C
−T−, −U−, −Z−
AE
P
V
V1
DETAIL Y
BASE
METAL
32
A1
A
25
4X
0.20 (0.008) AB T−U Z
1
−T−
B
B1
8
−U−
17
9
S1
S
8X
M_
R
J
G
−AB−
SEATING
PLANE
DETAIL AD
C E
SECTION AE−AE
−AC−
0.10 (0.004) AC
0.250 (0.010)
H
W
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE
−AB−
IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS
−T−, −U−,
AND
−Z−
TO BE
DETERMINED AT DATUM PLANE
−AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE
−AC−.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE
−AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.450
0.750
12
_
REF
0.090
0.160
0.400 BSC
1
_
5
_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.030
12
_
REF
0.004
0.006
0.016 BSC
1
_
5
_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
K
Q_
GAUGE PLANE
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
http://onsemi.com
10
0.20 (0.008)
9
−Z−
0.20 (0.008) AC T−U Z
F
D
M
4X
ÉÉ
ÉÉ
ÉÉ
ÉÉ
N
AC T−U Z
DETAIL Y
AE
ONSEMI [ ON SEMICONDUCTOR ]
