MC74AC157, MC74ACT157
MARKING DIAGRAMS
PDIP−16
MC74AC157N
AWLYYWW
SOIC−16
AC157
AWLYWW
TSSOP−16
EIAJ−16
AC
157
ALYW
74AC157
ALYW
MC74ACT157N
AWLYYWW
ACT157
AWLYWW
ACT
157
ALYW
74ACT157
ALYW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IN
I
OUT
I
CC
T
stg
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Sink/Source Current, per Pin
DC V
CC
or GND Current per Output Pin
Storage Temperature
Value
−0.5 to +7.0
−0.5 to V
CC
+0.5
−0.5 to V
CC
+0.5
±20
±50
±50
−65 to +150
Unit
V
V
V
mA
mA
mA
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
, V
OUT
Supply Voltage
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
@ 3.0 V
t
r
, t
f
Input Rise and Fall Time (Note 1)
I
t Ri
d F ll Ti
(N t
′AC
Devices except Schmitt Inputs
AC
exce t
In uts
V
CC
@ 4.5 V
V
CC
@ 5.5 V
t
r
, t
f
T
J
T
A
I
OH
I
OL
In ut
Input Rise and Fall Time (Note 2)
′ACT
Devices except Schmitt Inputs
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
Output Current − Low
V
CC
@ 4.5 V
V
CC
@ 5.5 V
Parameter
′AC
′ACT
Min
2.0
4.5
0
−
−
−
−
−
−
−40
−
−
Typ
5.0
5.0
−
150
40
25
10
8.0
−
25
−
−
Max
6.0
5.5
V
CC
−
−
−
−
−
140
85
−24
24
ns/V
°C
°C
mA
mA
ns/V
V
V
Unit
1. V
IN
from 30% to 70% V
CC
; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. V
IN
from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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