MC74AC377, MC74ACT377
ORDERING INFORMATION
Device
MC74AC377N
MC74AC377NG
MC74ACT377N
MC74ACT377NG
MC74AC377DW
MC74AC377DWG
MC74AC377DWR2
MC74AC377DWR2G
MC74ACT377DW
MC74ACT377DWG
MC74ACT377DWR2
MC74ACT377DWR2G
MC74AC377DT
MC74AC377DTG
MC74AC377DTR2
MC74AC377DTR2G
MC74ACT377MEL
MC74ACT377MELG
Package
PDIP−20
PDIP−20
(Pb−Free)
PDIP−20
PDIP−20
(Pb−Free)
SOIC−20
SOIC−20
(Pb−Free)
SOIC−20
SOIC−20
(Pb−Free)
SOIC−20
SOIC−20
(Pb−Free)
SOIC−20
SOIC−20
(Pb−Free)
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
SOEIAJ−20
SOEIAJ−20
(Pb−Free)
2000 / Tape & Reel
2500 / Tape & Reel
75 Units / Rail
1000 / Tape & Reel
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
18 Units / Rail
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
MARKING DIAGRAMS
PDIP−20
20
20
MC74ACT377N
AWLYYWWG
1
1
20
20
MC74AC377N
AWLYYWWG
1
1
1
AC377
AWLYYWWG
1
ACT377
AWLYYWWG
SOIC−20W
20
ACT
377
ALYWG
G
1
TSSOP−20
SOEIAJ−20
20
74ACT377
AWLYWWG
20
AC
377
ALYWG
G
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or
G
= Pb−Free Package
(Note: Microdot may be in either location)
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