MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
MJD31C and MJD32C are Preferred Devices
Complementary Power
Transistors
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching
applications.
Features
http://onsemi.com
•
•
•
•
•
•
Lead Formed for Surface Mount Applications in Plastic Sleeves
Straight Lead Version in Plastic Sleeves (“1” Suffix)
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
Electrically Similar to Popular TIP31 and TIP32 Series
Epoxy Meets UL 94, V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B
u
8000 V
Machine Model, C
u
400 V
•
Pb−Free Packages are Available
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
MJD31, MJD32
MJD31C, MJD32C
Collector−Base Voltage
MJD31, MJD32
MJD31C, MJD32C
Emitter−Base Voltage
Collector Current − Continuous
− Peak
Base Current
Total Power Dissipation @ T
C
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
V
EB
I
C
I
B
P
D
P
D
T
J
, T
stg
V
CB
40
100
5
3
5
1
15
0.12
1.56
0.012
−65 to
+ 150
Vdc
Adc
Adc
W
W/°C
W
W/°C
°C
Symbol
V
CEO
40
100
Vdc
1
2
3
Max
Unit
Vdc
1 2
3
SILICON
POWER TRANSISTORS
3 AMPERES
40 AND 100 VOLTS
15 WATTS
MARKING
DIAGRAMS
4
DPAK
CASE 369C
STYLE 1
YWW
J3xxG
4
DPAK−3
CASE 369D
STYLE 1
YWW
J3xxG
Y
WW
xx
G
= Year
= Work Week
= 1, 1C, 2, or 2C
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
Preferred
devices are recommended choices for future use
and best overall value.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient*
Lead Temperature for Soldering Purposes
Symbol
R
qJC
R
qJA
T
L
Max
8.3
80
260
Unit
°C/W
°C/W
°C
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
©
Semiconductor Components Industries, LLC, 2005
1
June, 2005 − Rev. 6
Publication Order Number:
MJD31/D
ONSEMI [ ON SEMICONDUCTOR ]
