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MKP1V160RLG 参数 Datasheet PDF下载

MKP1V160RLG图片预览
型号: MKP1V160RLG
PDF下载: 下载PDF文件 查看货源
内容描述: SIDAC高压双向触发0.9安培RMS 120 - 240伏 [Sidac High Voltage Bidirectional Triggers 0.9 AMPERES RMS 120 − 240 VOLTS]
分类和应用: 双向触发二极管高压
文件页数/大小: 5 页 / 59 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MKP1V120 Series
Preferred Device
Sidac High Voltage
Bidirectional Triggers
Bidirectional devices designed for direct interface with the ac power
line. Upon reaching the breakover voltage in each direction, the device
switches from a blocking state to a low voltage on−state. Conduction
will continue like a Triac until the main terminal current drops below
the holding current. The plastic axial lead package provides high pulse
current capability at low cost. Glass passivation insures reliable
operation.
Features
http://onsemi.com
SIDACS( )
0.9 AMPERES RMS
120 − 240 VOLTS
High Pressure Sodium Vapor Lighting
Strobes and Flashers
Ignitors
High Voltage Regulators
Pulse Generators
Used to Trigger Gates of SCR’s and Triacs
Indicates UL Registered — File #E116110
These are Pb−Free Devices*
MT1
MT2
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
V
"90
"180
"0.9
"4.0
−40 to +125
−40 to +150
A
A
Peak Repetitive Off−State Voltage
V
DRM
,
(Sine Wave, 50 to 60 Hz, T
J
= − 40 to 125°C) V
RRM
MKP1V120, MKP1V130, MKP1V160
MKP1V240
On-State Current RMS (T
L
= 80°C,
Lead Length = 3/8″, All Conduction Angles)
Peak Non−repetitive Surge Current
(60 Hz One Cycle Sine Wave, T
J
= 125°C)
Operating Junction Temperature Range
Storage Temperature Range
I
T(RMS)
I
TSM
T
J
T
stg
AXIAL LEAD
CASE 59
STYLE 2
MARKING DIAGRAM
°C
°C
A
MKP
1Vxx0
YYWW
G
G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
Lead Length = 3/8″
Lead Solder Temperature
(Lead Length
w
1/16″ from Case, 10 s Max)
Symbol
R
qJL
T
L
Max
40
260
Unit
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
A
= Assembly Location
MKP1Vxx0 = Device Number
x= 12, 13, 16 or 24
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
October, 2006 − Rev. 10
Publication Order Number:
MKP1V120/D