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MM3Z3V0ST1G 参数 Datasheet PDF下载

MM3Z3V0ST1G图片预览
型号: MM3Z3V0ST1G
PDF下载: 下载PDF文件 查看货源
内容描述: 齐纳稳压器 [Zener Voltage Regulators]
分类和应用: 稳压器
文件页数/大小: 5 页 / 107 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MM3ZxxxST1G Series,
SZMM3ZxxxST1G Series
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
Specification Features
http://onsemi.com
Standard Zener Breakdown Voltage Range
3.3 V to 36 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
SOD−323
CASE 477
STYLE 1
0.067″ x 0.049″ (1.7 mm x 1.25 mm)
Low Body Height: 0.035″ (0.9 mm)
Package Weight: 4.507 mg/unit
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Tight Tolerance V
Z
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
1
Cathode
2
Anode
MARKING DIAGRAM
XXMG
G
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
260°C for 10 Seconds
LEADS:
Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MOUNTING POSITION:
Any
ORDERING INFORMATION
Device
MM3ZxxxST1G
SZMM3ZxxxST1G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
MM3ZxxxST3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
June, 2013
Rev. 20
1
Publication Order Number:
MM3Z2V4ST1/D