MMBD914LT1
Preferred Device
High−Speed Switching
Diode
Features
•
Pb−Free Package is Available
http://onsemi.com
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM(surge)
Value
100
200
500
Unit
Vdc
mAdc
mAdc
3
Symbol
P
D
Max
225
1.8
R
qJA
Total Device Dissipation
Alumina Substrate (Note 2)
T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
R
qJA
Junction and Storage Temperature
Range
T
J
, T
stg
417
−55 to +150
P
D
556
300
2.4
Unit
mW
mW/°C
°C/W
mW
1
2
SOT−23
CASE 318
STYLE 8
3
CATHODE
1
ANODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
FR−5 Board (Note 1)
T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
MARKING DIAGRAM
mW/°C
°C/W
°C
1
5D M
G
G
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I
R
= 100
mAdc)
Reverse Voltage Leakage Current
(V
R
= 20 Vdc)
(V
R
= 75 Vdc)
Diode Capacitance
(V
R
= 0, f = 1.0 MHz)
Forward Voltage
(I
F
= 10 mAdc)
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc) (Figure 1)
V
(BR)
I
R
−
−
C
T
V
F
t
rr
−
−
−
25
5.0
4.0
1.0
4.0
nAdc
mAdc
pF
Vdc
ns
100
−
Vdc
Symbol
Min
Max
Unit
5D = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
MMBD914LT1
MMBD914LT1G
MMBD914LT3
MMBD914LT3G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
1. FR−5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 5
Publication Order Number:
MMBD914LT1/D
ONSEMI [ ON SEMICONDUCTOR ]
