欢迎访问ic37.com |
会员登录 免费注册
发布采购

MMSZ5258BT3 参数 Datasheet PDF下载

MMSZ5258BT3图片预览
型号: MMSZ5258BT3
PDF下载: 下载PDF文件 查看货源
内容描述: 齐纳稳压器 [Zener Voltage Regulators]
分类和应用: 稳压器二极管齐纳二极管测试光电二极管
文件页数/大小: 6 页 / 79 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
 浏览型号MMSZ5258BT3的Datasheet PDF文件第2页浏览型号MMSZ5258BT3的Datasheet PDF文件第3页浏览型号MMSZ5258BT3的Datasheet PDF文件第4页浏览型号MMSZ5258BT3的Datasheet PDF文件第5页浏览型号MMSZ5258BT3的Datasheet PDF文件第6页  
MMSZ5221BT1 Series
Preferred Device
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
http://onsemi.com
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (>16 kV) per Human Body Model
Pb−Free Packages are Available
1
Cathode
2
Anode
2
1
SOD−123
CASE 425
STYLE 1
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
xx
M
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ T
L
= 75°C
Derated above 75°C
Thermal Resistance, (Note 2)
Junction−to−Ambient
Thermal Resistance, (Note 2)
Junction−to−Lead
Junction and Storage Temperature Range
Symbol
P
D
500
6.7
R
qJA
R
qJL
T
J
, T
stg
340
150
−55 to
+150
mW
mW/°C
°C/W
°C/W
MMSZ52xxBT3
°C
MMSZ52xxBT3G
Max
Unit
ORDERING INFORMATION
Device**
MMSZ52xxBT1
MMSZ52xxBT1G
Package
SOD−123
SOD−123
(Pb−Free)
SOD−123
SOD−123
(Pb−Free)
Shipping
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
**The “T1” suffix refers to an 8 mm, 7 inch reel.
The “T3” suffix refers to an 8 mm, 13 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Devices listed in
bold, italic
are ON Semiconductor
Preferred
devices.
Preferred
devices are recommended
choices for future use and best overall value.
©
Semiconductor Components Industries, LLC, 2005
1
January, 2005 − Rev. 5
ÂÂ
ÂÂ
ÂÂ
xx M
= Specific Device Code
= Date Code
Publication Order Number:
MMSZ5221BT1/D