MMSZ2V4ET1 Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Specification Features
http://onsemi.com
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500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 56 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power − 225 W (8
X
20
ms)
1
Cathode
2
Anode
2
1
SOD−123
CASE 425
STYLE 1
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
≤
25°C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
L
= 75°C
Derated above 75°C
Thermal Resistance −
Junction−to−Ambient (Note 3)
Thermal Resistance −
Junction−to−Lead (Note 3)
Junction and Storage
Temperature Range
Symbol
P
pk
P
D
500
6.7
R
qJA
R
qJL
T
J
, T
stg
340
150
−55 to
+150
mW
mW/°C
°C/W
°C/W
°C
Max
225
Unit
Watts
MARKING DIAGRAM
xx
M
ORDERING INFORMATION
Device
MMSZxxxET1
MMSZxxxET3
Package
SOD−123
SOD−123
Shipping
†
3000/Tape & Reel
10,000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. Nonrepetitive current pulse per Figure 11
2. FR−5 = 3.5 X 1.5 inches, using the On minimum recommended footprint as
shown in Figure 12.
3. Thermal Resistance measurement obtained via infrared Scan Method
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2004
1
June, 2004 − Rev. 1
ÂÂ
ÂÂ
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xx M
= Specific Device Code
= Date Code
Publication Order Number:
MMSZ2V4ET1/D
ONSEMI [ ON SEMICONDUCTOR ]
