NPN − MPSA05, MPSA06*;
PNP − MPSA55, MPSA56*
*Preferred Devices
Amplifier Transistors
Voltage and Current are Negative
for PNP Transistors
http://onsemi.com
Features
NPN
COLLECTOR
3
2
BASE
1
EMITTER
2
BASE
1
EMITTER
PNP
COLLECTOR
3
•
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector −Emitter Voltage
MPSA05, MPSA55
MPSA06, MPSA56
Collector −Base Voltage
MPSA05, MPSA55
MPSA06, MPSA56
Emitter −Base Voltage
Collector Current − Continuous
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
60
80
V
CBO
60
80
V
EBO
I
C
P
D
P
D
T
J
, T
stg
4.0
500
625
5.0
1.5
12
−55 to +150
Vdc
mAdc
W
mW/°C
W
mW/°C
°C
Vdc
Value
Unit
Vdc
TO−92
CASE 29
STYLE 1
12
1
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
2
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
(Note 1)
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
200
83.3
Unit
°C/W
°C/W
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. R
qJA
is measured with the device soldered into a typical printed circuit board.
MPS
Axx
AYWW
G
G
xx
= 05, 06, 55, or 56
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2007
Preferred
devices are recommended choices for future use
and best overall value.
1
April, 2007 − Rev. 3
Publication Order Number:
MPSA05/D