MPSW05, MPSW06
One Watt Amplifier
Transistors
NPN Silicon
Features
http://onsemi.com
COLLECTOR
3
2
BASE
Symbol
MPSW05
MPSW06
MPSW05
MPSW06
V
CEO
V
CBO
V
EBO
I
C
P
D
P
D
T
J
, T
stg
Value
60
80
60
80
4.0
500
1.0
8.0
2.5
20
−55
to +150
Unit
Vdc
Vdc
Vdc
mAdc
W
mW/°C
W
mW/°C
°C
12
1
2
TO−92 1 WATT
(TO−226)
CASE 29−10
STYLE 1
1
EMITTER
•
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter
−Base
Voltage
Collector Current
−
Continuous
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
MPS
W0x
AYWW
G
G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
125
50
Unit
°C/W
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
x
= 5 or 6
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MPSW05G
MPSW06G
MPSW06RLRA
MPSW06RLRAG
Package
TO−92
(Pb−Free)
TO−92
(Pb−Free)
TO−92
TO−92
(Pb−Free)
Shipping
†
5000 Units/Bulk
5000 Units/Bulk
2000/Tape & Reel
2000/Tape & Reel
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
August, 2010
−
Rev. 4
1
Publication Order Number:
MPSW05/D
ONSEMI [ ON SEMICONDUCTOR ]
