MURA130T3, MURA140T3
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
Features
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.8 V Max @ 1.0 A, T
J
= 150°C)
Pb−Free Packages are Available
ULTRAFAST RECTIFIERS
1 AMPERE, 300−400 VOLTS
Mechanical Characteristics:
•
Case: Epoxy, Molded
•
Weight: 70 mg (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
Polarity: Polarity Band Indicates Cathode Lead
•
ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA130T3
MURA140T3
Average Rectified Forward Current
@ T
L
= 150°C
@ T
L
= 125°C
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Condtions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
1.0
2.0
I
FSM
35
A
Value
Unit
V
300
400
A
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
U4x
AYWW
G
U4x = Device Code
x = F for MURA130T3
= G for MURA140T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
T
J
−65 to +175
°C
Device
MURA130T3
Symbol
Psi
JL
(Note 2)
R
θJA
Max
24
216
MURA140T3G
SMA
(Pb−Free)
5000/Tape & Reel
Unit
°C/W
MURA140T3
MURA130T3G
Package
SMA
SMA
(Pb−Free)
SMA
Shipping
†
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
(T
L
= 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient
(Note 1)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Rating applies when surface mounted on the minimum pad size recommended,
PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R
θJL
)
are now referenced as Psi
JL
.
©
Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
1
February, 2006 − Rev. 4
Publication Order Number:
MURA130T3/D
ONSEMI [ ON SEMICONDUCTOR ]
