MURA205T3G,
MURA210T3G,
SURA8210T3G
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
http://onsemi.com
ULTRAFAST RECTIFIERS
2 AMPERES, 50−100 VOLTS
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.74 V Max @ 2.0 A, T
J
= 150C)
AEC−Q101 Qualified and PPAP Capable
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb-Free*
Mechanical Characteristics:
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
Case: Epoxy, Molded
Weight: 70 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
U5x
AYWW
G
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Protection:
Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U5x = Device Code
x = A for MURA205T3
= B for MURA210T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
MURA205T3G
MURA210T3G
SURA8210T3G
Package
SMA
(Pb−Free)
SMA
(Pb−Free)
SMA
(Pb−Free)
Shipping
†
5,000/Tape & Reel
5,000/Tape & Reel
5,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012
−
Rev. 4
1
Publication Order Number:
MURA205T3/D