MURA205T3, MURA210T3
Preferred Devices
Surface Mount Ultrafast
Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
Features
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.74 V Max @ 2.0 A, T
J
= 150°C)
Pb−Free Packages are Available
ULTRAFAST RECTIFIERS
2 AMPERES, 50−100 VOLTS
Mechanical Characteristics:
•
Case: Epoxy, Molded
•
Weight: 70 mg (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
Polarity: Polarity Band Indicates Cathode Lead
•
ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA205T3
MURA210T3
Average Rectified Forward Current
@ T
L
= 155°C
@ T
L
= 135°C
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
1.0
2.0
I
FSM
50
A
Value
Unit
V
50
100
A
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
U5x
AYWW
G
U5x = Device Code
x = A for MURA205T3
= B for MURA210T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
SMA
SMA
(Pb−Free)
SMA
SMA
(Pb−Free)
Shipping
†
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
5000/Tape & Reel
T
J
−65 to +175
°C
MURA205T3
MURA205T3G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
(T
L
= 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient
(Note 1)
Symbol
Psi
JL
(Note 2)
R
qJA
Max
24
216
Unit
°C/W
MURA210T3
MURA210T3G
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Rating applies when surface mounted on the minimum pad size
recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R
qJL
)
are now referenced as Psi
JL
.
©
Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
1
February, 2006 − Rev. 3
Publication Order Number:
MURA205T3/D
ONSEMI [ ON SEMICONDUCTOR ]
