NGB8206N
Ignition IGBT
20 A, 350 V, N−Channel D
2
PAK
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features
monolithic circuitry integrating ESD and Overvoltage clamped
protection for use in inductive coil drivers applications. Primary uses
include Ignition, Direct Fuel Injection, or wherever high voltage and
high current switching is required.
Features
http://onsemi.com
•
Ideal for Coil−on−Plug and Driver−on−Coil Applications
•
Gate−Emitter ESD Protection
•
Temperature Compensated Gate−Collector Voltage Clamp Limits
•
•
•
•
•
•
Stress Applied to Load
Integrated ESD Diode Protection
Low Threshold Voltage for Interfacing Power Loads to Logic or
Microprocessor Devices
Low Saturation Voltage
High Pulsed Current Capability
Optional Gate Resistor (R
G
) and Gate−Emitter Resistor (R
GE
)
Pb−Free Packages are Available
20 AMPS, 350 VOLTS
V
CE(on)
= 1.3 V @
I
C
= 10 A, V
GE
.
4.5 V
C
G
R
G
R
GE
E
Applications
MARKING DIAGRAM
4 Collector
•
Ignition Systems
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Collector−Emitter Voltage
Collector−Gate Voltage
Gate−Emitter Voltage
Collector Current−Continuous
@ T
C
= 25°C
−
Pulsed
Continuous Gate Current
Transient Gate Current (t
≤
2 ms, f
≤
100 Hz)
ESD (Charged−Device Model)
ESD (Human Body Model)
R = 1500
W,
C = 100 pF
ESD (Machine Model) R = 0
W,
C = 200 pF
Total Power Dissipation @ T
C
= 25°C
Derate above 25°C
Operating & Storage Temperature Range
Symbol
V
CES
V
CER
V
GE
I
C
I
G
I
G
ESD
ESD
ESD
P
D
T
J
, T
stg
Value
390
390
$15
20
50
1.0
20
2.0
8.0
500
150
1.0
−55
to
+175
Unit
V
V
V
A
DC
A
AC
mA
mA
kV
kV
V
W
W/°C
°C
NGB8206NT4
NGB8206NT4G
GB8206N
A
Y
WW
G
1
D
2
PAK
CASE 418B
STYLE 4
GB
8206NG
AYWW
1
Gate
3
Emitter
2
Collector
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
NGB8206N
NGB8206NG
Package
D
2
PAK
D
2
PAK
(Pb−Free)
D
2
PAK
D
2
PAK
(Pb−Free)
Shipping
†
50 Units / Rail
50 Units / Rail
800 / Tape & Reel
800 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
August, 2006
−
Rev. 6
1
Publication Order Number:
NGB8206N/D
ONSEMI [ ON SEMICONDUCTOR ]
