NTGS3446
Power MOSFET
5.1 Amps, 20 Volts
N−Channel TSOP−6
Features
•
•
•
•
•
•
•
Ultra Low R
DS(on)
Higher Efficiency Extending Battery Life
Logic Level Gate Drive
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
I
DSS
Specified at Elevated Temperature
Pb−Free Package Option for Green Manufacturing (G Suffix)
http://onsemi.com
V
(BR)DSS
20 V
R
DS(on)
TYP
36 mW @ 4.5 V
I
D
MAX
5.1 A
Applications
N−Channel
Drain 1 2 5 6
•
Power Management in portable and battery−powered products, i.e.
computers, printers, PCMCIA cards, cellular and cordless
•
Lithium Ion Battery Applications
•
Notebook PC
Gate 3
MAXIMUM RATINGS
(T
C
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Drain Current
− Continuous @ T
A
= 25°C
− Pulsed Drain Current (t
p
t
10
ms)
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Drain Current
− Continuous @ T
A
= 25°C
− Pulsed Drain Current (t
p
t
10
ms)
Thermal Resistance
Junction−to−Ambient (Note 3)
Total Power Dissipation @ T
A
= 25°C
Drain Current
− Continuous @ T
A
= 25°C
− Pulsed Drain Current (t
p
t
10
ms)
Source Current (Body Diode)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
Symbol
V
DSS
V
GS
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
I
S
T
J
, T
stg
T
L
Value
20
±12
244
0.5
2.5
10
128
1.0
3.6
14
62.5
2.0
5.1
2.0
5.1
−55 to
150
260
Unit
V
V
°C/W
Watts
Amps
Amps
1
5
6
4
Source 4
MARKING
DIAGRAM
TSOP−6
CASE 318G
STYLE 1
= Device Code
= Work Week
446
W
2
3
°C/W
Watts
Amps
Amps
°C/W
Watts
Amps
Amps
A
°C
°C
446
W
PIN ASSIGNMENT
Drain Drain Source
6 5 4
1
2 3
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3446T1
NTGS3446T1G
Package
TSOP−6
TSOP−6
(Pb−Free)
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), operating to steady state.
3. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), t < 5.0 seconds.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2003
1
November, 2003 − Rev. 3
Publication Order Number:
NTGS3446/D
ONSEMI [ ON SEMICONDUCTOR ]
