NTGS3441T1
Power MOSFET
1 Amp, 20 Volts
P−Channel TSOP−6
Features
http://onsemi.com
•
•
•
•
Ultra Low R
DS(on)
Higher Efficiency Extending Battery Life
Miniature TSOP−6 Surface Mount Package
Pb−Free Package is Available
1 AMPERE
20 VOLTS
R
DS(on)
= 90 mW
P−Channel
1 2 5 6
Applications
•
Power Management in Portable and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
−
Continuous
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Drain Current
−
Continuous @ T
A
= 25°C
−
Pulsed Drain Current (T
p
t
10
mS)
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Drain Current
−
Continuous @ T
A
= 25°C
−
Pulsed Drain Current (T
p
t
10
mS)
Thermal Resistance
Junction−to−Ambient (Note 3)
Total Power Dissipation @ T
A
= 25°C
Drain Current
−
Continuous @ T
A
= 25°C
−
Pulsed Drain Current (T
p
t
10
mS)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
Symbol
V
DSS
V
GS
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
R
qJA
P
d
I
D
I
DM
T
J
, T
stg
T
L
Value
−20
"8.0
244
0.5
−1.65
−10
128
1.0
−2.35
−14
62.5
2.0
−3.3
−20
−55
to 150
260
Unit
V
V
°C/W
W
A
A
°C/W
W
A
A
°C/W
W
A
A
°C
°C
1
TSOP−6
CASE 318G
STYLE 1
4
3
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
6 5 4
PT M
G
G
1 2 3
Drain Drain Gate
= Specific Device Code
= Date Code*
= Pb−Free Package
M
PT
G
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Minimum FR−4 or G−10 PCB, operating to steady state.
2. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single
sided), operating to steady state.
3. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single
sided), t
t
5.0 seconds.
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
NTGS3441T1
NTGS3441T1G
Package
TSOP−6
Shipping
†
3000 / Tape & Reel
TSOP−6 3000 / Tape& Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 5
1
Publication Order Number:
NTGS3441T1/D
ONSEMI [ ON SEMICONDUCTOR ]
